Electronics Packaging
Dr. James Morris
Fall 2007
Tuesday/Thursday 2:00-3:50 p.m.
Proposed Lecture Sequence
- Introduction, overview, terminologies, historical perspective
- On-chip technologies, and packaging implications, assembly
- Electrical package design: reflections, crosstalk
- Electrical package design: delta-I noise, ground-plane issues
- Electrical package design: EMC, etc.
- Mechanical package design: stress/strain
- Mechanical package design: fracture mechanics
- Mechanical package design: pop-corning, etc
- Thermal package design: conduction, radiation
- Thermal package design: natural convection
- Thermal package design: forced convection
- Mid-term test
- Packaging materials & processing: metals, solders
- Packaging materials & processing: ceramics, sealing
- Packaging materials & processing: polymers, encapsulation
- Reliability issues: reliability theory
- Reliability issues: analytical instruments
- Reliability issues: thermal cycling, humidity, HAST
- Discrete passives, LCA, and other current topics
- Specialized packaging: optoelectronic, biomedical, MEMS, etc
Electronics packaging covers all technologies involved in device manufacture and design from the chip to the board. In modern devices, it is usually the package which limits system performance, and its cost can greatly exceed the cost of the silicon chip it supports. Packaging engineers are much in demand, therefore, due also to the fact that the field’s inherently multi-disciplinary nature creates a shortage of qualified people. Modern practice calls for chip/package co-design, making an understanding of packaging principles a must for all IC designers.
The primary objective of the course will be to develop the underlying principles and theory relevant to packaging applications. The minimal necessary descriptive material will be covered in the first two lectures to establish context and background. This material is inherently multidisciplinary, and collaboration with Mechanical & Materials Engineering is anticipated. In particular, a follow-on course (Electronics Packaging II) is expected to run in MME, with an ECE contribution in the application of EM theory of guided waves to micro-strip lines, extending the first course concepts.
Prerequisites: Senior or graduate standing in ECE or MME.
Text: Brown et al “Advanced Electronic Packaging” (IEEE Press) 1999
(2nd edition is due out fall 2005; use if available in time)
Supplemented by a number of reference texts, e.g.
Tummala et al “Fundamentals of Microsystem Packaging” (McGraw-Hill) 2001
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